抄録
Positive photoresist manufactured from diazonaphthoquinone (DNQ) with novolac, has been used, for long time, in IC fabrication. However, the requirement on the positive photoresist's quality must be increased continuously. The quality of photoresist is evaluated by the high resolution (μm), the high photosensitivity, the good mechanical, physical and chemical nature. In order to solve and satisfy the above-mentioned requirements, in the scientific research, there are the following variants:
1. To change the chemical composition of DNQ.
2. To manufacture the polymer blend as carrier for photoresist.
3. To study the compatibility of the mixed photoresist.
4. To study kinetics of processes of developing photoresist.
