Fabrication and Evaluation of the Micro-devices Using Ti-Ni-Cu Shape Memory Alloy Films as a Micro-actuator

Abstract

We have reported in the last meeting that Ti-Ni-Cu films deposited at an elevated temperature shows shape memory behavior in the as-deposited state. The purposes of this work are to establish the fabrication method of micro-devices (such as diaphragm or cantilever) and to evaluate their performance. We have confirmed that the operation temperature of devices seem to be the same as the transformation temperature of the self-standing Ti-Ni-Cu films having the identical chemical composition.