Study on Organic Fibers in The Polishing Pad for Sapphire Chemical Mechanical Polishing

抄録

Chemical mechanical polishing (CMP) is an essential process in the manufacturing of sapphire substrate that needs to achieve a smooth planar surface without subsurface damage. Definitely, the polishing pad is one of the dominant factors in the polishing. In recent years, there are trends to decrease the synthases material that formed by chemical production for our world environment. The organic fibers are having uniform structure, easy to fabricate from the natural or waste product from agro-industry or food industry, and can be control the diameter from micro unit until nano size such as cellulose nanofibers. This study aims to developed polishing pad with organic polishing pad from the several kinds of fibers such as; bamboo, sugarcane bagasse, banana, and pineapple fibers. As a result, naturally SiO₂-contained fiber types that were bamboo and bagasse, performed considerably higher material removal rate (MRR) more than a conventional pad by 157% and 191% respectively. On the other hand, none-SiO₂ fiber type (banana, pineapple) did not perform MRR completely. Therefore, we conclude that the SiO₂ in the organic fibers could improve a material removal rate of sapphire CMP.