溶接学会論文集
Online ISSN : 2434-8252
Print ISSN : 0288-4771
溶滴形成・移行過程における銅めっきの挙動に関する考察
-ソリッドワイヤの溶滴表面張力に関して-
清水 弘之伊藤 崇明宮本 隆志黒川 剛志
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2005 年 23 巻 1 号 p. 37-47

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High speed video image analysis, optical measurement, and sound pressure analysis were conducted to reveal the difference between Cu-coated solid wire's and non-Cu-coated solid wire's molten droplet formation and transfer. It was obvious that the molten droplet size of non-Cu-coated solid wire was smaller than that of Cu-coated solid wire in any welding conditions except for very slow droplet formation. As Cu coating diffusion time was similar to molten droplet formation and transfer time, Cu coating on solid wire surface influenced the formation and the transfer of molten droplet. Cu coating prevented oxidization on solid state wire surface, and reduced the amount of oxygen on the molten droplet surface. Non-Cu-coated solid wire was the ideal material for the formation of small molten droplets of the short-circuit and the spray transfer.

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© 2005 社団法人 溶接学会
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