抄録
This report considered the low melting point Au-Sn micro-soldering (connection heat tool temp. 523 K) which is applied to the combination leadframe assembling. This method is performed by heat and press tool connection of tin spot plated leads and gold plated interposer with non flux. Au-Sn micro-soldered layer has the high thermal resistance of 556 K and the high reliability in 423 K storage and the 358 K×85%RH electro-migration test (applied DC bias). And the organic polyimide base film is not damaged at micro-soldering temperature because of short connection time (5 second at 523 K).
