ノート
ヒドラジンを還元剤とするタングステン含有コバルトの無電解めっき
2004 年 55 巻 8 号 p. 565
詳細
2004 年 55 巻 8 号 p. 565
The electroless plating of a cobalt layer containing tungsten onto a copper substrate was investigated, using hydrazine as a reducing agent. The plating reaction was initiated by placing a strip of aluminium foil in contact with the substrate in the plating bath. Under optimized conditions, a uniform cobalt layer containing 0.9% tungsten was deposited with a deposition rate of 1.6μm h−1. As the concentration of tungstate in the plating bath was increased, the tungsten content of the resulting cobalt layer increased while the deposition rate decreased.
