ホルムアマイド浴による電解研摩

抄録

An investigation was made as to the possibility of anodic dissolution and electropolishing of Al, Cu and Fe in the formamide bath. Al dissolved anodically in the bath containing Cl^-, I^-, Br^-, ClO₃^-, ClO₄^-, etc. but in the bath containing NO₃^-, PO₄^3-, CO₃^2-, SO₄^2-, (COO)₂^2-, SO₃NH₂^-, BO₃^3-, etc. anodic film was formed.
Al was well polished in the HCONH₂-NH₄ClO₄ bath, and tests were made about the effect of salt concentration, temperature and stirring of the bath.
Addition of water more than 15% by volume inhibits the polishing effect.
Cu and Fe dissolve anodically in almost all the baths, but resulting in the formation of pits and rough surfaces.
Anodic reactions of these metals in various baths are divided into three groups. It might be deduced that in formamide bath the electropolishing mechanism is similar to that in aqueous solutions.