It was experimentally shown that when nickel oxide films were formed on nickel films electrodeposited by controlled potential technique, solderability declined with increasing quantity of electricity in anodic oxidation. Nickel films 1∼7μm in thickness were electrodeposited from a Watts bath. The real thickness of nickel oxide films was represented by the quantity of electricity in anodic oxidation because measurement by ellipsometry had a large error. Soldering to electrodeposited nickel films was virtually impossible in anodic oxidation at quantities over 15.5×10-3C cm-2. Solderability was not affected at quantities below 3.0×10-3C cm-2. After nickel electrodeposition, the nickel oxide films were dissolved by hydrogen forming by cathodic reduction at -1.40V vs. Ag/AgCl and solderability was raised.