IEICE Transactions on Electronics
Online ISSN : 1745-1353
Print ISSN : 0916-8524
Special Section on Electronic Displays
Proposal of Novel Temperature-Independent Zero-Zero-Birefringence Polymer with High Heat-Resistance
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2021 Volume E104.C Issue 2 Pages 59-63


Temperature-independent zero-zero-birefringence polymer (TIZZBP), which exhibits very small birefringence over the wide temperature range, is required to realize real-color images for displays, particularly vehicle-mounted displays. Previously, a TIZZBP was synthesized, but they did not put into practical use because of their too complex composition and low mechanical strength. In this paper, we propose a practical TIZZBP that has high heat resistance, high transparency and sufficient mechanical strength, using a simple binary copolymerization system. Our proposed novel polymer exhibits very low photoelastic birefringence and very low orientational birefringence. Both types of birefringence of this TIZZBP satisfy the negligible levels for displays, which are defined as follows: the absolute values of photoelastic coefficient and intrinsic birefringence are less than 1 ×10-12 Pa-1 and 1 ×10-3, respectively. In addition, temperature dependency of orientational birefringence was very low. Orientational birefringence satisfies the negligible level all over the temperature range from around -40°C to 85°C. This temperature range is important because it is the operational temperature range for vehicle-mounted display. Furthermore, our proposed novel TIZZBP showed high heat resistance, high transparency and sufficient mechanical strength. The glass transition temperature was 194°C. The total light transmittance and the haze value is more than 91% and less than 1%, respectively. The tensile strength of non-oriented films was 35 ~ 50 MPa. These results suggest our proposed novel TIZZBP has high practicality in addition to very low birefringence. Therefore, this TIZZBP film will be very useful for various displays including vehicle-mounted displays and flexible displays.

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© 2021 The Institute of Electronics, Information and Communication Engineers
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