Toward Realization of Scalable Packaging and Wiring for Large-Scale Superconducting Quantum Computers

Shuhei TAMATE; Yutaka TABUCHI; Yasunobu NAKAMURA

doi:10.1587/transele.2021SEP0007

IEICE Transactions on Electronics

Online ISSN : 1745-1353
Print ISSN : 0916-8524

Special Section on Progress & Trend of Superconductor-based Computers

Toward Realization of Scalable Packaging and Wiring for Large-Scale Superconducting Quantum Computers

Shuhei TAMATE, Yutaka TABUCHI, Yasunobu NAKAMURA

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Keywords: superconducting qubit, sample packaging, three-dimensional wiring

JOURNAL FREE ACCESS

2022 Volume E105.C Issue 6 Pages 290-295

DOI https://doi.org/10.1587/transele.2021SEP0007

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Abstract

In this paper, we review the basic components of superconducting quantum computers. We mainly focus on the packaging and wiring technologies required to realize large-scalable superconducting quantum computers.

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