Deposition of Inclined Magnetic Anisotropy Film by Oblique Incidence Collimated Sputtering

Abstract

Deposition of inclined anisotropy film for bit-patterned media was studied using an oblique incidence collimated sputtering. Pt underlayer increased the inclination angle of magnetic layer more than 5° on a Ta seed layer. Further increase of the angle was obtained by annealing Pt/Ru underlayer resulting an inclination angle of 9.4° for a Co-Cr_15.5 film on the underlayer. The magnetic properties of the Co-Cr_15.5 film with an inclined orientation was estimated comparing measured hysteresis loops with simulated ones, which indicated to have inclined magnetic anisotropy with an anisotropy field of about 4.5kOe and a deflection angle of the anisotropy about the same as that of the crystalline orientation.