Abstract
A three dimensional (3D) chip stack featuring a 4096-bit wide I/O demonstrator incorporates an in-place waveform capturer on an intermediate interposer within the stack. The capturer includes probing channels on paths of signaling as well as in power delivery and collects analog waveforms for diagnosing circuits within 3D integration. The collection of in-place waveforms on vertical channels with through silicon vias (TSVs) are demonstrated among 128 vertical I/O channels distributed in 8 banks in a 9.9mm × 9.9mm die area. The analog waveforms confirm a full 1.2-V swing of signaling at the maximum data transmission bandwidth of 100GByte/sec with sufficiently small deviations of signal skews and slews among the vertical channels. In addition, it is also experimentally confirmed that the signal swing can be reduced to 0.75V for error free data transfer at 100GByte/sec, achieving the energy efficiency of 0.21pJ/bit.
