論文ID: 2019CTP0008
This paper presents a design of CMOS transimpedance amplifier (TIA) and peaking inductor for high speed, low power and small area. To realize high density integration of optical I/O, area reduction is an important figure as well as bandwidth, power and so on. To determine design parameters of multi-stage inverter-type TIA (INV-TIA) with peaking inductors, we derive a simplified model of the bandwidth and the energy per bit. Multi-layered on-chip inductors are designed for area-effective inductive peaking. A 5-stage INV-TIA with 3 peaking inductors is fabricated in a 65-nm CMOS. By using multi-layered inductors, 0.02 mm2 area is achieved. Measurement results show 45 Gb/s operation with 49 dBΩ transimpedance gain and 4.4 mW power consumption. The TIA achieves 98 fJ/bit energy efficiency.
