Article ID: 2021FUP0003
In this research, we investigated the metal-ferroelectric-semiconductor field-effect transistors (MFSFETs) with 5 nm thick nondoped HfO2 gate insulator by decreasing the sputtering power for Pt gate electrode deposition. The leakage current was effectively reduced to 2.6×10-8 A/cm2 at the voltage of -1.5 V by the sputtering power of 40 W for Pt electrode deposition. Furthermore, the memory window (MW) of 0.53 V and retention time over 10 years were realized.