IEICE Transactions on Electronics
Online ISSN : 1745-1353
Print ISSN : 0916-8524

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MFSFET with 5 nm thick ferroelectric nondoped HfO2 gate insulator utilizing low power sputtering for Pt gate electrode deposition
Joong-Won ShinMasakazu TanumaShun-ichiro Ohmi
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JOURNAL RESTRICTED ACCESS Advance online publication

Article ID: 2021FUP0003

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Abstract

In this research, we investigated the metal-ferroelectric-semiconductor field-effect transistors (MFSFETs) with 5 nm thick nondoped HfO2 gate insulator by decreasing the sputtering power for Pt gate electrode deposition. The leakage current was effectively reduced to 2.6×10-8 A/cm2 at the voltage of -1.5 V by the sputtering power of 40 W for Pt electrode deposition. Furthermore, the memory window (MW) of 0.53 V and retention time over 10 years were realized.

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