IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences
Online ISSN : 1745-1337
Print ISSN : 0916-8508
Regular Section
An Efficient Multi-Level Algorithm for 3D-IC TSV Assignment
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2017 Volume E100.A Issue 3 Pages 776-784


Through-silicon via (TSV) assignment problem is one of the key design challenges of 3-D IC which is crucial to the wire length and signal delay. In this work we formulate the 3-D IC TSV assignment as an Integer Minimum Cost Multi Commodity (IMCMC) problem on a IMCMC network, and propose a multi-level algorithm. It coarsens the IMCMC network level by level, applies a rough flow assignment on each level of coarsened graph, and generates only promising edges to reduce the IMCMC network size. Benefiting from the multi-level structure, we propose a mixed single and multi commodity flow method improve the TSV assignment solution quality. Moreover, given a TSV assignment, we propose an extended layer by layer algorithm to further optimize the TSV assignment. The experimental results demonstrate that our multi-level with mixed single and multi commodity flow algorithm achieves not only smaller wire length but also shorter runtime compared to other existing works.

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© 2017 The Institute of Electronics, Information and Communication Engineers
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