Abstract
Three-dimensional integrated circuits (3-D ICs), i.e., stacked dies, can alleviate the interconnect problem coming with the decreasing feature size and increasing integration density, and promise a solution to heterogenous integration. The vertical connection, which is generally implemented by the through-the-silicon via, is a key technology for 3-D ICs. In this paper, given 3-D circuit placement or floorplan results with white space reserved between blocks for inter-layer interconnections, we proposed methods for assigning inter-layer signal via locations. Introducing a grid structure on the chip, the inter-layer via assignment of two-layer chips can be optimally solved by a convex-cost max-flow formulation with signal via congestion optimized. As for 3-D ICs with three or more layers, the inter-layer signal via assignment is modeled as an integral min-cost multi-commodity flow problem, which is solved by a heuristic method based on the lagrangian relaxation. Relaxing the capacity constraints in the grids, we transfer the min-cost multi-commodity flow problem to a sequence of lagrangian sub-problems, which are solved by finding a sequence of shortest paths. The complexity of solving a lagrangian sub-problem is $O(n_{nt}n_g^2)$, where nnt is the number of nets and ng is the number of grids on one chip layer. The experimental results demonstrated the effectiveness of the method.
