Vacuum and Surface Science
Online ISSN : 2433-5843
Print ISSN : 2433-5835
Special Feature : Progress and Prospect of Semiconductor Integrated Circuit Technology by 3D Stacked Integrated Device
The Evolutionary Process for 3D Stacked CMOS Image Sensor and the Advanced Technologies
Kyohei MIZUTAHidenobu TSUGAWARyoichi NAKAMURAYoshihisa KAGAWATomohiro TAKAHASHIMasaki SAKAKIBARAKeiji TATANI
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2019 Volume 62 Issue 11 Pages 660-665

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Abstract

In recent years, imaging quality of a CMOS image sensor (CIS) is remarkably improving. This paper reviews the technology development of CIS for mobile devices.

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この記事はクリエイティブ・コモンズ [表示 - 非営利 4.0 国際]ライセンスの下に提供されています。
https://creativecommons.org/licenses/by-nc/4.0/deed.ja
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