積層型CMOSイメージセンサの進化と最新技術

水田 恭平; 津川 英信; 中邑 良一; 香川 恵永; 高橋 知宏; 榊原 雅樹; 田谷 圭司

doi:10.1380/vss.62.660

Special Feature : Progress and Prospect of Semiconductor Integrated Circuit Technology by 3D Stacked Integrated Device

The Evolutionary Process for 3D Stacked CMOS Image Sensor and the Advanced Technologies

Kyohei MIZUTA , Hidenobu TSUGAWA, Ryoichi NAKAMURA, Yoshihisa KAGAWA, Tomohiro TAKAHASHI, Masaki SAKAKIBARA, Keiji TATANI

Author information

Keywords: CMOS image sensor, back illuminated, 3D stacked, 3-layer stacked, Cu-Cu connections

JOURNAL FREE ACCESS

2019 Volume 62 Issue 11 Pages 660-665

DOI https://doi.org/10.1380/vss.62.660

Details

Abstract

In recent years, imaging quality of a CMOS image sensor (CIS) is remarkably improving. This paper reviews the technology development of CIS for mobile devices.

Fullsize Image

Corresponding author

Register with J-STAGE for free!