Vacuum and Surface Science
Online ISSN : 2433-5843
Print ISSN : 2433-5835
Special Feature : Progress and Prospect of Semiconductor Integrated Circuit Technology by 3D Stacked Integrated Device
R&D of 3D-IC Technology for the AI·IoT Era
Katsuya KIKUCHI
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Keywords: AI·IoT, 3D integration, CoC, WoW
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2019 Volume 62 Issue 11 Pages 666-671

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Abstract

3D integration is one of the most important technologies for developing new-generation electronics devices. In this article, it is reported R&D of 3D integration for contributing to the AI·IoT era.

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この記事はクリエイティブ・コモンズ [表示 - 非営利 4.0 国際]ライセンスの下に提供されています。
https://creativecommons.org/licenses/by-nc/4.0/deed.ja
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