Special Feature : Progress and Prospect of Semiconductor Integrated Circuit Technology by 3D Stacked Integrated Device
R&D of 3D-IC Technology for the AI·IoT Era
2019 Volume 62 Issue 11 Pages 666-671
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2019 Volume 62 Issue 11 Pages 666-671
3D integration is one of the most important technologies for developing new-generation electronics devices. In this article, it is reported R&D of 3D integration for contributing to the AI·IoT era.
