In recent years, imaging quality of a CMOS image sensor (CIS) is remarkably improving. This paper reviews the technology development of CIS for mobile devices.

3D integration is one of the most important technologies for developing new-generation electronics devices. In this article, it is reported R&D of 3D integration for contributing to the AI·IoT era.

3D integration is one of the most important technologies for developing new-generation electronics devices.

In this article, bonding technologies, key factor of 3D integration are introduced. In particular, fusion bonding method and direct bonding method have the potential for wafer level bonding.