Thermoplastic-photoconductor medium combines many advantages, such as dry and nearly instantaneous in-situ development, erasability, high diffraction efficiency, etc. But this medium is not so stable for the change of circumstances especially the variation of atmospheric temperature if the usual heating method is used to soften a plastic layer. The solvent vapour method, which uses a solvent vapour insteat of heating, has been developed in order to improve the defects originating in the Joule's heat of usual heating method.
The difference of sensitivity and maximum diffraction efficiency between the solvent vapour method and the heating method has been studied and the followings are found.
(1) The sensitivity on the solvent vapour method is higher than that of the heating method.
(2) The maximum diffraction efficiency on the solvent vapour method is higher than that of the heating method.
Research has been carried out to explain these features and it becomes clear that the main reason for these results is the difference of the transparent conductor-photoconductor interface conditions between the solvent vapour method and the heating method. Namely, the interface in the solven vapour method is analogous to that of the insulator-metal system, but it is analogous to that of the p-type semiconductor-metal system in the heatig metod. Anothr reasson is the edge effect in the solvent vapour meteod is stronger than that of the heatinsr method.
View full abstract