TEION KOGAKU (Journal of Cryogenics and Superconductivity Society of Japan)
Online ISSN : 1880-0408
Print ISSN : 0389-2441
ISSN-L : 0389-2441
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Volume 44, Issue 6
Displaying 1-3 of 3 articles from this issue
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Preface
Review Article
  • Progress of Packaging Technologies for Superconducting Electronic Devices
    Superconducting Electronic Systems with a Cryocooler
    Hideo SUZUKI
    2009 Volume 44 Issue 6 Pages 260-268
    Published: 2009
    Released on J-STAGE: August 03, 2009
    DOIhttps://doi.org/10.2221/jcsj.44.260
    JOURNAL FREE ACCESS
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    Many superconducting electronic devices have been developed with LTS and HTS technologies. However, until a few years ago, only a few developments at the system level, including cryocoolers, had been seen, despite reliable cryocoolers being released in the 1990s. One of the problems is that researchers in the field of superconducting electronics are unfamiliar with cryocoolers and packaging technologies. Additionally, specialized designing is required for each system. Recently, many prototype cryocooled- systems have been developed for several applications. This paper reviews superconducting electronic systems with cryocoolers and their packaging technologies.
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Original
  • Fabrication of YBCO Thin Film on {100}<001> Textured Ni-electroplated Cube-textured Cu Tape
    Ryota TOMIYASU, Toshiya DOI, Makoto TOKUDOME, Manabu DAIO, Yoshinori H ...
    2009 Volume 44 Issue 6 Pages 269-277
    Published: 2009
    Released on J-STAGE: August 03, 2009
    DOIhttps://doi.org/10.2221/jcsj.44.269
    JOURNAL FREE ACCESS
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    Cube-textured Cu tape is highly desirable as a substrate for practical superconducting wires operating in the liquid nitrogen temperature regions, because not only is Cu a non-ferromagnetic metal, the material cost is also much cheaper than Ni or Ni-based alloys. The primary disadvantage, however, is that Cu has poor resistance to oxidation in an oxygen atmosphere at high temperature during the fabrication of YBCO. We therefore added a Ni overlayer on top of the {100}<001> textured Cu tape by electroplating, to reduce the oxidation rate of the Cu substrate. We successfully obtained biaxially oriented YBCO films with a critical current density (Jc) over 4.5 MA/cm2 in a self-field at 77 K on cube-textured Cu tapes using CeO2/YSZ/CeO2/Ni buffer layers.
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