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HYBRIDS
Online ISSN : 1884-1171
Print ISSN : 0914-2568
ISSN-L : 0914-2568
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Journal of The Japan Institute of Electronics Packaging
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
Journal of SHM
Circuit Technology
Volume 8 (1992)
Issue 6 Pages 2-
Issue 5 Pages 2-
Issue 4 Pages 2-
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Volume 7 (1991)
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Volume 6 (1990)
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Volume 5 (1989)
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Volume 4 (1988)
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Volume 3 (1987)
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Volume 2 (1986)
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Volume 1 (1985)
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Volume 3, Issue 2
Displaying 1-6 of 6 articles from this issue
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The International Standard of Hybrid IC
Shigeyuki Nagasawa
1987 Volume 3 Issue 2 Pages 2-5
Published: April 01, 1987
Released on J-STAGE: March 18, 2010
DOI
https://doi.org/10.5104/jiep1985.3.2_2
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(576K)
Bendable IMST Substrate for High-Density Miniaturized Hybrids
Sumio Ishihara, Katsutoshi Uchida, Shinichi Toyooka
1987 Volume 3 Issue 2 Pages 6-10
Published: April 01, 1987
Released on J-STAGE: March 18, 2010
DOI
https://doi.org/10.5104/jiep1985.3.2_6
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(2717K)
IC Card and Hybrid Technology
Hirosi Ohdaira, Masayuki Ohuchi, Akinori Hongu
1987 Volume 3 Issue 2 Pages 11-16
Published: April 01, 1987
Released on J-STAGE: March 18, 2010
DOI
https://doi.org/10.5104/jiep1985.3.2_11
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(2062K)
Present and Future of Low Temperature Fireable Ceramic Sabstrate
Susumu Nishigaki
1987 Volume 3 Issue 2 Pages 17-28
Published: April 01, 1987
Released on J-STAGE: March 18, 2010
DOI
https://doi.org/10.5104/jiep1985.3.2_17
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(9609K)
A Report on ISHM Internepcon '87 Seminar
Takeshi Wada
1987 Volume 3 Issue 2 Pages 29-30
Published: April 01, 1987
Released on J-STAGE: March 18, 2010
DOI
https://doi.org/10.5104/jiep1985.3.2_29
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(236K)
Announcement of 2nd Microelectronies Symposium
Fumio Miyashiro
1987 Volume 3 Issue 2 Pages 31-33
Published: April 01, 1987
Released on J-STAGE: March 18, 2010
DOI
https://doi.org/10.5104/jiep1985.3.2_31
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(483K)
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