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HYBRIDS
Online ISSN : 1884-1171
Print ISSN : 0914-2568
ISSN-L : 0914-2568
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Journal of The Japan Institute of Electronics Packaging
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
Journal of SHM
Circuit Technology
Volume 8 (1992)
Issue 6 Pages 2-
Issue 5 Pages 2-
Issue 4 Pages 2-
Issue 3 Pages 3-
Issue 2 Pages 2-
Issue 1 Pages 1-
Volume 7 (1991)
Issue 5 Pages 1-
Issue 4 Pages 2-
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Volume 6 (1990)
Issue 4 Pages 2-
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Volume 5 (1989)
Issue 4 Pages 3-
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Issue 1 Pages 1-
Volume 4 (1988)
Issue 4 Pages 3-
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Volume 3 (1987)
Issue 4 Pages 2-
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Issue 1 Pages 1-
Volume 2 (1986)
Issue 4 Pages 3-
Issue 3 Pages 2-
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Issue 1 Pages 1-
Volume 1 (1985)
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Volume 3, Issue 3
Displaying 1-6 of 6 articles from this issue
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Metallurgical Consideration on Bonding Process in Semiconductor Devices
Shuji Nakata
1987 Volume 3 Issue 3 Pages 3-21
Published: July 01, 1987
Released on J-STAGE: March 18, 2010
DOI
https://doi.org/10.5104/jiep1985.3.3_3
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(8205K)
Thic Film Materiales for Copper Hybrid Circuits
Shyoichi Muramoto, Kazuo Akiba, Nobuyoshi Tanaka
1987 Volume 3 Issue 3 Pages 11-15
Published: July 01, 1987
Released on J-STAGE: March 18, 2010
DOI
https://doi.org/10.5104/jiep1985.3.3_11
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(5191K)
Flexible Printed Circuit and it's Aprications for Still Camera
Koji Yukawa
1987 Volume 3 Issue 3 Pages 16-21
Published: July 01, 1987
Released on J-STAGE: March 18, 2010
DOI
https://doi.org/10.5104/jiep1985.3.3_16
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(5479K)
Noble Metal-Coated Powder Prepared by Gelation Method-Application to Thick Film Pasta
Shinroku Kawasumi
1987 Volume 3 Issue 3 Pages 22-26
Published: July 01, 1987
Released on J-STAGE: March 18, 2010
DOI
https://doi.org/10.5104/jiep1985.3.3_22
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(6776K)
Film Forming by Thermal Decomposition of Organic Precious Metal Compounds
Yoshitaka Yamaguchi
1987 Volume 3 Issue 3 Pages 27-30
Published: July 01, 1987
Released on J-STAGE: March 18, 2010
DOI
https://doi.org/10.5104/jiep1985.3.3_27
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Announcement of IMC 1988
Mikio Hanzawa
1987 Volume 3 Issue 3 Pages 31-32
Published: July 01, 1987
Released on J-STAGE: March 18, 2010
DOI
https://doi.org/10.5104/jiep1985.3.3_31
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