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HYBRIDS
Online ISSN : 1884-1171
Print ISSN : 0914-2568
ISSN-L : 0914-2568
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Journal of The Japan Institute of Electronics Packaging
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
Journal of SHM
Circuit Technology
Volume 8 (1992)
Issue 6 Pages 2-
Issue 5 Pages 2-
Issue 4 Pages 2-
Issue 3 Pages 3-
Issue 2 Pages 2-
Issue 1 Pages 1-
Volume 7 (1991)
Issue 5 Pages 1-
Issue 4 Pages 2-
Issue 3 Pages 2-
Issue 2 Pages 3-
Issue 1 Pages 1-
Volume 6 (1990)
Issue 4 Pages 2-
Issue 3 Pages 3-
Issue 2 Pages 2-
Issue 1 Pages 1-
Volume 5 (1989)
Issue 4 Pages 3-
Issue 3 Pages 2-
Issue 2 Pages 2-
Issue 1 Pages 1-
Volume 4 (1988)
Issue 4 Pages 3-
Issue 3 Pages 2-
Issue 2 Pages 2-
Issue 1 Pages 1-
Volume 3 (1987)
Issue 4 Pages 2-
Issue 3 Pages 3-
Issue 2 Pages 2-
Issue 1 Pages 1-
Volume 2 (1986)
Issue 4 Pages 3-
Issue 3 Pages 2-
Issue 2 Pages 2-
Issue 1 Pages 1-
Volume 1 (1985)
Issue 4 Pages 2-
Issue 3 Pages 2-
Issue 2 Pages 2-
Issue 1 Pages 1-
Volume 5, Issue 2
Displaying 1-9 of 9 articles from this issue
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Bonding and Interconnection
1989 Volume 5 Issue 2 Pages 2
Published: April 01, 1989
Released on J-STAGE: March 18, 2010
DOI
https://doi.org/10.5104/jiep1985.5.2_2
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(2009K)
Interaction between Different Materials
Masako Nakahashi
1989 Volume 5 Issue 2 Pages 3-8
Published: April 01, 1989
Released on J-STAGE: March 18, 2010
DOI
https://doi.org/10.5104/jiep1985.5.2_3
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(3716K)
Adhesion Mechanisms in Silver/Glass Die Attachment with Silicon Die
—Gold and Chromium/Gold Backed Die—
Kunisuke Matsuda
1989 Volume 5 Issue 2 Pages 9-14
Published: April 01, 1989
Released on J-STAGE: March 18, 2010
DOI
https://doi.org/10.5104/jiep1985.5.2_9
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(4019K)
Low Temperature Soldering in SMT
Kazuhiro Aburaya, Masayoshi Iida, Yoshikuni Taniguchi
1989 Volume 5 Issue 2 Pages 15-20
Published: April 01, 1989
Released on J-STAGE: March 18, 2010
DOI
https://doi.org/10.5104/jiep1985.5.2_15
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(4429K)
Development of a Direct Gold Wire Bonding On Copper Lead Frame
Hisao Masuda, Hitoshi Fujimoto, Syuichi Osaka, Toshinobu Banjo
1989 Volume 5 Issue 2 Pages 21-26
Published: April 01, 1989
Released on J-STAGE: March 18, 2010
DOI
https://doi.org/10.5104/jiep1985.5.2_21
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(2513K)
Technologies of Hybrid and Gas Sensors (II)
Hozumi Futata
1989 Volume 5 Issue 2 Pages 27-31
Published: April 01, 1989
Released on J-STAGE: March 18, 2010
DOI
https://doi.org/10.5104/jiep1985.5.2_27
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(3507K)
A Report on '89 SHM Seminar
Tsuneo Kaneko
1989 Volume 5 Issue 2 Pages 32-34
Published: April 01, 1989
Released on J-STAGE: March 18, 2010
DOI
https://doi.org/10.5104/jiep1985.5.2_32
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(1932K)
Announcement of 3rd Microelectronics Symposium (MES'89)
Akira Okamoto
1989 Volume 5 Issue 2 Pages 35
Published: April 01, 1989
Released on J-STAGE: March 18, 2010
DOI
https://doi.org/10.5104/jiep1985.5.2_35
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(115K)
ERRATUM
1989 Volume 5 Issue 2 Pages 38
Published: 1989
Released on J-STAGE: March 18, 2010
DOI
https://doi.org/10.5104/jiep1985.5.2_38
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(39K)
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