The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

Published by The Japan Institute of Electronics Packaging

308 registered articles
(updated on April 25, 2024)

Online ISSN : 1884-1201
Print ISSN : 1341-0571
ISSN-L : 1341-0571

JOURNAL FREE ACCESS

1998 Volume 13 Issue 2

How Far Could We Go with High Density MCM/CSP Substrate? Jun SASAKI
Fluxless Solder Joining Using Alkane Toshihiro MIYAKE, Koji KONDO, Fumio OHARA, Nozomu OKUMURA
Build up Multilayer Printed Circuit Board Technology Morio GAKU
Polymeric Optical Waveguide with 45°Mirror for Optical Surface Mount Technology Akira ICHIMURA, Osamu MIKAMI, Teiji UCHIDA, Ryoukou YOSHIMURA, Makoto HIKITA

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Most viewed articles (March 2024)

1

Evaluation Methods of Reliability on Copper Foil for Use in PCBs

Released on J-STAGE: March 18, 2010 | Volume 10 Issue 2 Pages 90-95

Masahiro MIKAMO, Takeshi YAMAGISHI, Kazuyoshi ASO
2

Adhesion and Structure of Copper Oxide Films

Released on J-STAGE: March 18, 2010 | Volume 11 Issue 6 Pages 423-428

Kun'ichi MIYAZAWA, Junji MIYAKE, Takaaki HATANO, Taketo SAKUMA
3

Mechanism and Suppression of Ion Migration in Printed Circuit Boards

Released on J-STAGE: March 18, 2010 | Volume 10 Issue 2 Pages 80-86

Toshiyuki OHTORI
4

Toughening of Epoxy Resins

Released on J-STAGE: March 18, 2010 | Volume 11 Issue 1 Pages 53-58

Masao TOMOI
5

Properties of Sn-Bi Solders and Its Interface with Cu

Released on J-STAGE: March 18, 2010 | Volume 12 Issue 6 Pages 406-412

Katsuaki SUGANUMA, Koichi NIIHARA, Tatsumi MORITHO, Yoshikazu NAKAMURA

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Predecessor

Circuit Technology

Successor

Journal of The Japan Institute of Electronics Packaging

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