The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

Published by The Japan Institute of Electronics Packaging

308 registered articles
(updated on March 06, 2026)

Online ISSN : 1884-1201
Print ISSN : 1341-0571
ISSN-L : 1341-0571

JOURNAL FREE ACCESS

1998 Volume 13 Issue 2

Release of Solder on Printed Circuit Boards by Heating and Vibrating Katsuhito NAKAZAWA, Hironobu SAKATA, Hiroyasu SAKAMURA, Itaru YASUI
Development of a Quatitative Evaluation Method for Solderability of PWB Tamiharu MASATOKI, Kenji AZUMA
Photoimagable Dielectric Material for Build-up Printed Wiring Board Toru TAKAHASHI
Electroless Nickel Plating on Tin-Doped Indium Oxide Films Isamu MOCHIZUKI, Katuhiko FURUSAWA, Hideo HONMA

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Most viewed articles (February 2026)

1

A Study on Mechanism of Ion Migration

Released on J-STAGE: March 18, 2010 | Volume 10 Issue 2 Pages 101-107

Yoshiyuki TSURU, Toshiro OKAMURA, Masao KANNO
2

Toughening of Epoxy Resins

Released on J-STAGE: March 18, 2010 | Volume 11 Issue 1 Pages 53-58

Masao TOMOI
3

Adhesion and Structure of Copper Oxide Films

Released on J-STAGE: March 18, 2010 | Volume 11 Issue 6 Pages 423-428

Kun'ichi MIYAZAWA, Junji MIYAKE, Takaaki HATANO, Taketo SAKUMA
4

Properties of Sn-Bi Solders and Its Interface with Cu

Released on J-STAGE: March 18, 2010 | Volume 12 Issue 6 Pages 406-412

Katsuaki SUGANUMA, Koichi NIIHARA, Tatsumi MORITHO, Yoshikazu NAKAMURA
5

Optical Coupling—Endeavor to Minimize Optical Coupling Loss

Released on J-STAGE: March 18, 2010 | Volume 12 Issue 7 Pages 512-515

Shinji TSUJI

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Circuit Technology

Successor

Journal of The Japan Institute of Electronics Packaging

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