巻号一覧
3 巻 (2003)
- 4 号 p. 221-
- 3 号 p. 141-
- 2 号 p. 59-
- 1 号 p. 3-
前身誌
3 巻, 1 号
選択された号の論文の5件中1～5を表示しています
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Daniel POST2003 年 3 巻 1 号 p. 3-8
発行日: 2003/03/25
公開日: 2010/03/19
ジャーナル フリーThe characteristics and basic concepts of moiré interferometry are reviewed. Significant examples from the fields of composite materials, electronic packaging and micromechanics are presented. Data are received as fringe patterns, which are contour maps of the in-plane U and V displacement fields. The typical sensitivity is 2.4 fringes/μm displacement. Characteristics include excellent fringe visibility, high spatial resolution and very large dynamic range. Normal and shear strains can be extracted readily from the displacement fields.抄録全体を表示PDF形式でダウンロード (1257K) -
岸本 哲2003 年 3 巻 1 号 p. 9-14
発行日: 2003/03/25
公開日: 2010/03/19
ジャーナル フリーElectron Moiré method is an advanced technique to measure the micro-deformation of the structural materials. In this method, a fine micro-grid prepared by electron beam lithography is used as a model grid, and a scanning exposure of the primary electron beam in a scanning electron microscope (SEM) as a master grid. The scanning exposure of the electron beam on the specimen with the model grid produces moiré fringes of bright and dark lines formed in response to the different amount of the emitted secondary electrons for each primary electron. By this method, inhomogeneous deformations of the materials were measured.抄録全体を表示PDF形式でダウンロード (2137K) -
新井 泰彦, 藤田 武良, 横関 俊介2003 年 3 巻 1 号 p. 15-20
発行日: 2003/03/25
公開日: 2010/03/19
ジャーナル フリーA novel stress analysis method using a high precise shape measurement method by moiré topography and finite element method is discussed in this paper. The validity of the proposed method is checked using a macro model for static and dynamic deformation. Furthermore, the internal stress caused with a deformation of the micro cantilever can be estimated by the proposed method according to the result of the macro model. The possibility of the expansion of new coverage of an optical measurement technology based on the fringe scanning method can be expected by the possibility of such a new technology shown in this paper.抄録全体を表示PDF形式でダウンロード (1061K) -
久能 和夫2003 年 3 巻 1 号 p. 21-27
発行日: 2003/03/25
公開日: 2010/03/19
ジャーナル フリーThis report contains two methods to analyze a digital interferometry image. One is a direct method that uses digital image processing techniques to extract fringes of the image. We showed the processing techniques in a specific example applied for composite laminates with a circular hole. The other method is based on the 2-D continuous wavelet transform method to analyze the displacement field. The method is especially useful for analyses of images that contain strain concentration and discontinuous displacement. We showed the advantages of the wavelet transform method over a conventional Fourier transform method by applying it to moiré interference fringe on composite laminates.抄録全体を表示PDF形式でダウンロード (2980K) -
森田 康之, 新川 和夫, 東藤 貢2003 年 3 巻 1 号 p. 28-33
発行日: 2003/03/25
公開日: 2010/03/19
ジャーナル フリーThe thermal deformations of electronic package, SOJ (Small Outline J-Leaded Package), were measured by phasc-shifting moiré interferometry. This method was developed using a wedge-glass-plate as a phase shifter to obtain the displacement fields with the sensitivity of 100nm/line. Digital image processing was also introduced to determine the strain distributions quantitatively. Thermal loading was applied by heating the package from room temperature 25°C to an elevated temperature 100°C. The thermal strains were then investigated with the two packages before and after mounted on PWB (Printed Wiring Board). The results showed that the strains increased about 50% after mounted on the PWB.抄録全体を表示PDF形式でダウンロード (2165K)
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