In recent years, electrically controlled variable pitch propeller mechanism has been widely used as a way to improve fuel economy and help protect the environment.

In the field of hydroelectric power generation, the Kaplan turbine has the same structure as variable pitch propellers for ships, and in 1994, the world’s first hydraulic power plant incorporating synchronous differential transmission mechanism-based electric variable pitch propellers began operationsed. Subsequently in 2007, a 10,500kW Kaplan turbine using the electric variable-pitch propeller mechanism　started operations at the Shin-Chuubetsu Power Station in Hokkaido Electric Power Company. This paper describes the development process and characteristics of the synchronous differential transmission mechanism developed at that time. The mechanism enables the use of electric variable pitch propellers with power capacity up to 22,000kW, and it can also be applied to large vessels. This paper also explains the structure, main characteristics, of the mechanism and its scope of application.

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　ヒドロキノン(HQ)とエピカテキン(EC)を,ショ糖を供与体としてβ-フルクトフラノシダーゼの糖転移反応により配糖化した.数種類の酵素を比較した結果,Arthrobacter属由来の酵素が最も効果的であった.HQの配糖化生成物(HQβ-フルクトフラノシド,HQF)は,HQ濃度0.4M,ショ糖濃度1.0Mで最も効率的に合成された.HQFはゲル濾過により単離し,13GNMRにより構造を確認した.ECの配糖化は,反応系におけるECの溶解性を上げるために5%2-プロパノールの存在下で行った.ECからは2種類の転移生成物が約7:2の比率で生成した.これらのうち,主生成物をシリカゲルクロマトグラフィー,ゲル濾過,調整用HPLCで単離した.13C-NMR分析により,ECの3位の水酸基が配糖化されていると推定された.HQFとECFはマウスメラノーマ細胞のチロシナーゼ活性を阻害した.この酵素はメラニン合成のキー酵素であり,皮膚の美白物質としての応用の可能性が示唆された.

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Circuit formation by a semi-additive process of copper films on glass was investigated. Copper films were produced on a glass substrate by direct electroless copper plating on a 20-30-nm-thick copper inclusive titanium oxide catalytic adhesion layer formed earlier on the glass substrate surface using a sol-gel method. After seed layer deposition, galvanic deposition thickened the copper film to 10 μm. Formation of L / S ＝ 50/50 μm to 200/200 μm copper circuit patterns on the glass substrate was then demonstrated, where adhesion was maintained throughout the process. The copper-inclusive titanium oxide adhesion layer was removed completely from the glass substrate surface without notably altering the glass surface morphology using a sodium hydroxide 100 g / L, trisodium citrate 5 g / L solution etching solution. Furthermore, in post electroless Ni-P plating, extraneous deposition was prevented by complete removal of the titanium oxide adhesion layer.

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For the field of nickel electroforming, where thickness of about 100-500 μm is obtained at the current density of 20-50 A/dm², increase in the current density is demanded for higher plating speed. Regarding the environmental impact, a plating bath without boric acid is also in demand.
Results obtained from studying various organic acids to replace boric acid show that acetic acid facilitates high-speed plating without burning at a current density of up to 200 A/dm². The effect of acetic acid was attributed to its excellent buffering capability.

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　Cyclomaltodextrin glucanotransferase (CGTase) has been efficiently applied to complexation of vitamin E in brown rice (Rice) and unpolished six-row barley (Barley). The results are shown as follows. ① Rice showed a higher vitamin E content than that of Barley, whereas the composition and contents of tocopherol and tocotrienol of Rice were similar to those of Barley. ② Production of cyclodextrin (CD) from Rice with CGTase showed a tendency to increase in cultivars having lower amylose content. ③ CD was produced from Rice and Barley with CGTase below 30% ethanol concentration. The composition of CD depended on the ethanol concentration of and raw material used. ④ The vitamin E-CD complex was produced below 30% of ethanol concentration by treating Rice and Barley with CGTase, and the content of vitamin E in the complex increased with increasing in ethanol concentration. ⑤ The complex exhibited a high water-solubility (about 90% or higher) below 30% ethanol concentration. ⑥ The complex produced in the presence of ethanol exhibited that the antioxidant capacity increased with increasing ethanol concentration to 30%.

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For reinforcing existing wooden buildings against severe earthquakes, surrounding metal poles installed and secured with bolts at the beams of the second floor level are effective. On an earthquake, the horizontal forces are mostly transmitted via second floor to the surrounding poles. This solution prevents the house from falling down, like felled "by a leg throw", and protects the residents therein. Parametric earthquake response analyses to several model houses have been conducted. Consequently, sufficient seismic safety regarding subject reinforcement method is confirmed.

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Fine pattern formation（L/S＝less than 50 μm）using electroless nickel/gold plating, extraneous nickel deposition on the resin area of a fine pattern is often observed because of residual palladium catalyst on the patterns. Thinner nickel plating was applied to solve the problem. However, a tendency for local nickel corrosion caused by the immersion gold plating step increases. Also, the solder connection reliability decreases compared to conventional nickel/gold processing. Accordingly, this study investigated the influence of palladium catalyst deposition conditions on electroless nickel/gold plated film properties. We propose direct electroless nickel strike plating on copper patterns without the palladium catalyst. Generally, solder bonding strength with electroless thin nickel /gold plating decreased concomitantly with increased palladium catalyst treatment time. In contrast, the nickel strike plating time does not influence solder bonding strength. Uniform nickel deposition and good solder bonding strength were achieved by applying the electroless nickel strike plating method.

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Electroless thin film nickel / gold plating processes have been applied to fine copper pattern surfaces. Generally, a palladium catalyst treatment is used as a pretreatment of electroless nickel plating. As described in earlier reports, using an electroless nickel strike plating solution without palladium catalyst improved the solder ball shear properties. Complexing agent selection of nickel strike plating solution was examined in this study to improve solder ball shear properties because the nickel complexing agent in the electroless nickel strike plating solution influences them. Results show that complexing agents with high chelating activity for nickel ions such as citric acid exhibit excellent solder ball shear properties.

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An electroplated Ni–P film with about 0.9 wt% co-deposited phosphorus was obtained using a sulfamic-acid-type Ni electroplating solution containing 0.05 mol/dm³ of phosphoric acid for improvement of corrosion resistance. However, crack-formation-deposited Ni–P films were often observed under operation at pH 4. This problem was resolved by operation at pH of 2.5. Furthermore, we were able to achieve crack-free Ni-P deposition with high current density. Moreover, bright Ni–P films were obtained using acetic acid or formic acid as the organic acid. The phosphorus content might be controllable by changing the phosphorous acid concentration. Crack-free Ni–P films with about 4.0 wt% co-deposited phosphorus were formed by addition of 0.4 mol/dm³ phosphorous acid and 0.2 mol/dm³ acetic acid as the organic acids. Next, we plated various Ni(3 μm) and Au–Co(0.03 μm) films on test substrates for which the corrosion resistance of the resulting electroplated Au–Co/Ni films were examined. The electroplated Au–Co/Ni–P films were superior corrosion-resistant electroplated Ni films. Their corrosion resistance improved with the increase of phosphorus content.

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