IEICE Electronics Express
Online ISSN : 1349-2543
ISSN-L : 1349-2543
LETTER
Algorithm-hardware co-design of ultra-high radix based high throughput modular multiplier
Hao XiaoYuxuan LiuZhenmin LiGuangzhu Liu
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2021 Volume 18 Issue 10 Pages 20210135

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Abstract

This paper presents an algorithm-hardware co-design of ultra-high radix modular multiplier for high throughput modular multiplication. First, to speed up the modular multiplication, we exploit an ultra-high radix interleaved modular multiplication algorithm with a novel segmented reduction method, which reduces the number of iterations and pre-computations. Then, to further improve the throughput of the modular multiplication, we design a highly parallel modular multiplier architecture. Finally, we implement and verify the modular multiplier using the Xilinx Virtex-7 FPGA. Experimental results show it can perform a 256-bit modular multiplication in 0.56 µs with the throughput rate of up to 4999.7 Mbps.

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© 2021 by The Institute of Electronics, Information and Communication Engineers
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