Design, simulate and performance an embedded fan-out package for 2-D ultrasonic transducer arrays

Abstract

In this article, the embedded fan-out wafer-level packaging (FO-WLP) for 2-D ultrasonic transducer array with individual electrical connection is proposed. The finite element analysis (FEA) was employed to analyze effects of the package on ultrasonic transducers. The layout of the package was designed based on single-element FEA models. The impedance characteristic of the encapsulated array was measured. The model of encapsulated array was established. The simulation and measured results of the encapsulated array show that the effective electromechanical coupling coefficient is remarkable affected by redistribution layers (RDLs) and passivation layers (PLs).