抄録
This paper describes the electrodeposition characteristics of an organic insulator film on a gold surface. In the electrodeposition, there are two reaction patterns depending on the solution temperature. Below around 30°C, the film thickness saturates regardless of deposition time after it rapidly increases. On the other hand, above around 30°C, the film thickness gradually increases with time and does not saturate. Using the solution temperature of 30°C, the organic dielectric was deposited to coat microelectromechanical-system structures. The deposition was confirmed to occur only on the gold electrode to which a voltage was applied. The fabricated structures with the coated electrodes were protected from the electrical shorts between the actuator and the gold electrode, even though pull-in occurred.
