抄録
Various Si molds with different side wall roughness were fabricated and the demolding forces for the thermal imprint to PMMA film were examined. The pattern size was the 2 μm half pitch line and space with the aspect ratio of about 2. The demolding force greatly depended on the side wall roughness of the mold. The demolding force normalized by the total side wall area of line patterns was 0.34 MPa for the smooth side wall mold.
