抄録
Wafer-level packaging is one of the most important aspects in manufacturing of sensor and microelectromechanical system (MEMS) devices. It determines the cost, yield, reliability, and long-term stability of these devices. In recent years, low-temperature wafer bonding has become a very important packaging and sealing technology for the realization of advanced devices integrated with dissimilar materials. This paper focuses on low temperature sealing technologies (< 200°C) using metal thin films and solders and reviews the state-of-the-art low-temperature sealing technologies.
