Young液によるCu単結晶(111)面の溶解速度の温度依存性

抄録

The effect of etching temperature on the dissolution rates at edge dislocation sites and dislocation-free sites of the (111) surface of copper single crystals was studied. The etching was carried out at temperatures 270 to 285 K for 5 to 25 s with Young’s etchant containing (NH₄)₂S₂O₈ 1 kmol·m⁻³, NH₄OH 6 kmol·m⁻³ and NH₄Br 0.3 kmol·m⁻³. From the measured data on the width and depth of dislocation etch pits and the dissolved thickness of the (111) matrix surface as a function of etching time, the linear dissolution rates parallel and normal to the surface at dislocation sites, v_h and v_d, and the dissolution rate normal to the surface at dislocation-free sites, v_s, were calculated. As a result, it was found that the dissolution rates were in the order of v_h>v_d>v_s at any temperature and that they increased as the etching temperature increased. These results were qualitatively discussed by the kinetic theory of two-dimensional nucleation and step motion for crystal dissolution and some kinetic quantities relating to the formation of two-dimensional nucleus and the step motion were evaluated.