精密工学会誌
Online ISSN : 1882-675X
Print ISSN : 0912-0289
ISSN-L : 0912-0289
セラミックス引っかきによる円すいダイヤモンドの付着及び摩耗
張 璧戸倉 和吉川 昌範
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1987 年 53 巻 12 号 p. 1931-1937

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Single-point diamonds are used to scratch the surfaces of HP-Al2O3, HP-Si3N4 and S-SiC. When depth of cut is about 2μm, the diamond tips are worn by either the single-plane or the double-plane or the microfracture type. The wear rate of S-SiC is the highest and then HP-Si3N4 and HP-Al2O3 in turn. When depth of cut is larger than 2, um, the adhesion is remarkably severe. The adhered layer has a tendency to become thinner as the scratching speed increases. It exhibits swelling and partly flaking repeatedly in the scratching process.

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