抄録
This report deals with both microscopic and macroscopic behaviors of the CBN wheel surface during the cylindrical traverse grinding, which are closely related to the grinding performance. The microscopic behaviors are investigated by observing the cutting edges, and by measuring the cutting edge spacing and the depth of chip pocket with a newly developed equipment, the computer handling system of wheel surface. In the circumferencial wheel surface of starting side, the bond is removed rapidly and the wear, the fracture and falling-off of cutting edges occur within the initial stage of grinding, so that the depth of chip pocket and the cutting edge spacing increase rapidly to the certain value, respectively, corresponding to the grinding conditions, that is, the larger depth of chip pocket than that obtained with the usual method is required in this area. These phenomena are observed in the advanced stage of grinding as the position of wheel surface is apart from the starting side, and the large amount of stock removal is necessary at the opposite side of the wheel. The wheel shape during grinding changes in company with the behavior of cutting edges.
