画像解析による砥石作業面の評価 (第1報)

砥粒および切れ刃摩耗面分布のポストプロセス測定

抄録

The working surface of a grinding wheel is characterized by means of an image processing, in which a picture of a wheel surface is taken by the CCD camera through the optical microscope on the grinding machine and analyzed with the personal computer. In this study, surface distributions of abrasive grains and wear-flat area of cutting edges on the wheel surface -the static number of abrasive grains G and cutting edges C per unit area, the successive cutting-edge spacing λ and the cutting-edge ratio η -are measured as a first step. Abrasive grains and wear-flat areas can be extracted mainly by the hue and the brilliance informations of the picture, respectively for resin bond diamond wheel (SDC 140 N 75 B) with relatively high accuracy. Overall processing time required for measuring these parameters is about 150 seconds per picture. The value of G is distributed in the range of 20 to 25 mm^-2 in the circumferential wheel direction. The mean value of η is about 3.1% even in the initial stage after the truing and dressing. Those values do not change very much with grinding of normally sintered Si₃N₄ at an certain grinding condition because that few grains are fractured or fallen off.