大重量主軸台の原子レベル超磁歪位置決め/アライメントシステムの開発 φ300mmSiウエハ超加工機械の中核技術

江田 弘; 周 立波; 近藤 良; 中野 博民; 森 輝夫; 清水 淳

doi:10.2493/jjspe.69.100

大重量主軸台の原子レベル超磁歪位置決め/アライメントシステムの開発

φ300mmSiウエハ超加工機械の中核技術

江田弘, 周立波, 近藤良, 中野博民, 森輝夫, 清水淳

著者情報

ジャーナルフリー

2003 年 69 巻 1 号 p. 100-104

DOI https://doi.org/10.2493/jjspe.69.100

詳細

発行日: 2003/01/05 受付日: 2002/05/21 J-STAGE公開日: 2009/04/10 受理日: - 早期公開日: - 改訂日: -
訂正情報
訂正日: 2009/04/10 訂正理由: - 訂正箇所: 論文サブタイトル訂正内容: Wrong : Core Technology for Advanced φ300mm Si Wafer Ultraprecision Machine Tool
Right : Core Technology for Advanced ∅300mm Si Wafer Ultraprecision Machine Tool

訂正日: 2009/04/10 訂正理由: - 訂正箇所: 論文抄録訂正内容: Wrong : In order to achieve damage free surface of Si wafer by a single step grinding process, each cutting edge should be controlled below the critical depth of cut. Additionally, the achievable wafer flatness by infeed grinding significantly depends upon the alignment between the wafer and the wheel. As one of the core technologies of an integrated manufacturing system for Φ300mm silicon wafer, a GMM (giant magnetostrictive material) actuated positioning/alignment device has been designed and developed to control half a ton payload at Å resolution over the several μm stroke range (about 5μm) and simultaneously to align the co-axis between the work and wheel at the resolution of 0.1". This paper describes the design of the GMM actuator and elastically deformable mechanism for position/alignment, the control schemes and on-situ performance.
Right : In order to achieve damage free surface of Si wafer by a single step grinding process, each cutting edge should be controlled below the critical depth of cut. Additionally, the achievable wafer flatness by infeed grinding significantly depends upon the alignment between the wafer and the wheel. As one of the core technologies of an integrated manufacturing system for ∅300mm silicon wafer, a GMM (giant magnetostrictive material) actuated positioning/alignment device has been designed and developed to control half a ton payload at Å resolution over the several μm stroke range (about 5μm) and simultaneously to align the co-axis between the work and wheel at the resolution of 0.1″. This paper describes the design of the GMM actuator and elastically deformable mechanism for position/alignment, the control schemes and on-situ performance.

訂正日: 2009/04/10 訂正理由: - 訂正箇所: キーワード情報訂正内容: Wrong : GMM (giant magnetostrictive material) actuator, positioning, alignment, atomic level, Preisach model, H_∞control
Right : GMM (giant magnetostrictive material) actuator, positioning, alignment, atomic level, Preisach model, H_∞control

訂正日: 2009/04/10 訂正理由: - 訂正箇所: 引用文献情報訂正内容: 訂正前 : 1) A.E. Clark,江田弘:超磁歪材料,日刊工業新聞社,(1995)93.
3) 江田弘,周立波,中野博民,近藤良,清水淳,田島琢二:大口径φ300mmSi ウエハ用超加工機械の開発,精密工学会誌,67,10(2001)1693.
4) 周立波,篠原一宏,清水淳,江田弘:大口径シリコンウエハ研削加工における幾何と運動,精密工学会誌,68,1(2002)125.
6) 江田弘:常温超磁歪材料開発?アクチュエータデバイスおよびセンサへの応用?,精密工学会誌,57,3(1991)445-452.
7) 江田弘,小野間隆,佐橋政司,小林忠彦:超磁歪アクチュエータに関する研究?大出力・超精密位置決め装置の開発?,精密工学会誌,57,3(1991)532.
9) I.D. Mayergoys: Mathematical Models of Hysteresis, IEEE Trans. on Magnetics, MAG-22, 5 (1986) 603, また Springer-Verlag New york Ink.(1991).
11) 黒田晃弘,近藤良:相補重みによるH_∞サーボ系設計,計測自動制御学会論文集,33,12(1997)1140.

訂正後 : 1) A.E. Clark,江田弘:超磁歪材料,日刊工業新聞社,(1995)93.
3) 江田弘,周立波,中野博民,近藤良,清水淳,田島琢二:大口径φ300mmSi ウエハ用超加工機械の開発,精密工学会誌,67,10(2001)1693.
4) 周立波,篠原一宏,清水淳,江田弘:大口径シリコンウエハ研削加工における幾何と運動,精密工学会誌,68,1(2002)125.
6) 江田弘:常温超磁歪材料開発?アクチュエータデバイスおよびセンサへの応用?,精密工学会誌,57,3(1991)445-452.
7) 江田弘,小野間隆,佐橋政司,小林忠彦:超磁歪アクチュエータに関する研究?大出力・超精密位置決め装置の開発?,精密工学会誌,57,3(1991)532.
9) I.D. Mayergoys: Mathematical Models of Hysteresis, IEEE Trans. on Magnetics, MAG-22, 5 (1986) 603, また Springer-Verlag New york Ink.(1991).
11) 黒田晃弘,近藤良:相補重みによるH_∞サーボ系設計,計測自動制御学会論文集,33,12(1997)1140.

訂正日: 2009/04/10 訂正理由: - 訂正箇所: PDFファイル訂正内容: -

抄録

In order to achieve damage free surface of Si wafer by a single step grinding process, each cutting edge should be controlled below the critical depth of cut. Additionally, the achievable wafer flatness by infeed grinding significantly depends upon the alignment between the wafer and the wheel. As one of the core technologies of an integrated manufacturing system for ∅300mm silicon wafer, a GMM (giant magnetostrictive material) actuated positioning/alignment device has been designed and developed to control half a ton payload at Å resolution over the several μm stroke range (about 5μm) and simultaneously to align the co-axis between the work and wheel at the resolution of 0.1″. This paper describes the design of the GMM actuator and elastically deformable mechanism for position/alignment, the control schemes and on-situ performance.

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