抄録
Pad has a significant effect on Chemical Mechanical Polishing (CMP) preformance because of its properties. Generally, it is known that conventional polishing pad has irregular pores and asperities. Also, material removal rate decreases due to smoothing asperities and glazing phenonema of pad surface without conditioning during polishing process. So, a new pad with microstructure is fabricated by micro-molding technology, and its performance is verified through evaluation of removal rate, non-uniformity and repeatability in ILD CMP. For better stable material removal rate, the contact area should be maintained in a constant manner, and is realized in the new pad.
