抄録
Diallyl phthalate resin molding compound was modified with an epoxy resin in order to improve adhesive property in the presence of an allyl ester derivative (DAPY) having allyl group and carboxylic acid as a compatibilizer. Peel strength of plating copper was measured to evaluate the adhesive properties of modified diallyl phthalate resin molding compound.By adding 10% epoxy resin and DAPY of the equiponderance with epoxy resin, the peel strength was improved by seventy times. This can be explained by the generation of hydroxyl groups, resulting from the reaction of epoxide and carboxylic acid; that is, introduced hydroxyl groups can increase the adhesion force between the cured resin and a copper surface.
