抄録
The accelerating effect of sorbic acid on the thermal injury of yeast cells was investigated under various conditions. With presence of sorbic acid, thermal destruction of several yeast strains was accelerated to shorten the decimal reduction time to 30% or below of that for control. Although the acceleration at heating treatment was more remarkable at lower pH, it was not affected significantly by other factors, such as heating temperature, concentration of sorbic acid, nutrients, cell age, and recovery methods, under conditions examined.
