抄録
The relocation of diamond fillers was performed in polysiloxane/diamond composite film under different electric fields. The diamond fillers in micro-dimension were dispersed by sonication in a prepolymer mixture of polysiloxane followed by high speed mixing. The homogeneous suspension was cast onto a polyamide spacer of microscale thickness and applied to three different electric fields before the mixture became cross-linked. Analysis revealed that self-assembles of linearly aligned diamond fillers (LADFs) are fabricated in the composite film while connecting the film planes as bridges with different thickness depending on the condition of the electric fields. The composites with assembles of LADFs exhibit enhanced thermal conductivity with electric insulation that are attractive for applications for thermal interface materials in semiconductor industry.
