表面技術
Online ISSN : 1884-3409
Print ISSN : 0915-1869
ISSN-L : 0915-1869
研究論文
高速スパッタリングと湿式法を併用したThrough Glass Via(TGV)へのCu皮膜の形成
高山 昌敏井上 浩徳渡邊 充広
著者情報
キーワード: Glass, TGV, Sputtering, Plating
ジャーナル フリー

2021 年 72 巻 9 号 p. 503-507

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抄録

Glass substrates with through-glass vias (TGVs) are being developed to improve large-volume and high-speed data communications technologies. To use the substrate as a circuit board, it is necessary to apply highly conductive Cu film on the glass substrate and to form uniform Cu film, even inside through holes. However, forming a uniform metal film on high-aspect-ratio through holes is difficult using conventional high-vacuum sputtering. Therefore, we specifically examined the throwing power of low-vacuum sputtering and formed a Cu film inside through holes of the TGV substrate using a wet plating process combined with sputtering. By selecting an appropriate Cu-plating solution and by optimizing Cu-plating conditions and plated film properties, annealing conditions, and an oxide film form method, we achieved 1.0 kN/m adhesion strength for a Cu film formed directly on a glass substrate. Results of our study also suggest the possibility of performing conformal plating on through holes having a 3.75 aspect ratio(0.3 mm glass thickness, φ80 μm opening diameter).

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