表面技術
Online ISSN : 1884-3409
Print ISSN : 0915-1869
ISSN-L : 0915-1869
ヒドラジンを還元剤とした無電解ニッケルめっき膜の平滑化とキャップメタルへの応用
田代 雄彦山本 誠二渡辺 大樹本間 英夫川島 敏
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2002 年 53 巻 1 号 p. 71-77

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An electroless nickel plating bath was examined using hydrazine as a reducing agent to improve the bath stability. The plating films obtained from the basic bath are pure nickel, however, the plating films tend to show a dendrite structure of a black appearance. Therefore, the deposited films are not applicable to electronics fields. This report examines smoothing the plating films obtained from a basic bath using hydrazine as a reducing agent.
Smoothing the plating films was accomplished by lowering the reducing power of hydrazine whilst the basic bath is left at a high temperature for several days. Sulphur compounds as additives and gluconic acid as a complexing agent were also effective in achieving bath stability and smoothness of deposits.
Nickel can be directly deposited on copper substrate from a hydrazine reduced electroless nickel bath without a palladium activation step. Therefore, the applicability of the formation of capping metal on ULSI devices was also investigated. As a result, it was confirmed that selective capping metal deposition on the 250nm copper pads can be accomplished by this bath without palladium catalyst treatment.

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