特集「真空機器の表面改質および被覆技術」
半導体製造工程におけるコンタミネーション制御
2020 年 63 巻 2 号 p. 64-68
詳細
2020 年 63 巻 2 号 p. 64-68
The cause of contaminations of the inner wall of the vacuum chamber and inside samples or wafers are thought to be metal particles.
The metal particles are generated due to corrosion of the chamber itself, pipes, various parts and flanges, made of metal such as stainless steel. In this paper I introduce surface treatment and its effect as countermeasure against metal contamination caused by corrosion of stainless steel.
