The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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Volume 11, Issue 5

Displaying 1-17 of 17 articles from this issue

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Supporting Role of MCM in High Density Packaging

Kanji OTSUKA

1996Volume 11Issue 5 Pages 301-305
Published: August 20, 1996
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep1995.11.301

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New Movement of Multi Chip Module

Yutaka TSUKADA

1996Volume 11Issue 5 Pages 306-310
Published: August 20, 1996
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep1995.11.306

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Recent Technology Trends on MCM Organic Substrates

Kiyoshi TAKAGI

1996Volume 11Issue 5 Pages 311-315
Published: August 20, 1996
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep1995.11.311

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Card PC

Toru ASAKURA

1996Volume 11Issue 5 Pages 316-318
Published: August 20, 1996
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep1995.11.316

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PDA (Personal Digital Assistance)

Akihiro DOHYA, Tsuneaki TAJIMA

1996Volume 11Issue 5 Pages 319-322
Published: August 20, 1996
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep1995.11.319

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MCM and Bare Chip Technology for a Wide Range of Computers

Akihiko FUJISAKI, Kazuhisa TSUNOI

1996Volume 11Issue 5 Pages 323-327
Published: August 20, 1996
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep1995.11.323

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Multi Chip Module Technologies for High-Throughput ATM Switching Systems

Tohru KISHIMOTO, Katsumi KAIZU, Shinichi SASAKI

1996Volume 11Issue 5 Pages 328-332
Published: August 20, 1996
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep1995.11.328

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Seramics RF-MCM for Functional Substrate

Chihiro MAKIHARA, Masami TERASAWA

1996Volume 11Issue 5 Pages 333-337
Published: August 20, 1996
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep1995.11.333

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Photosensitive Material for Via Hole Formation and Build Up Printed Wiring Boards

Mineo KAWAMOTO, Masashi MIYAZAKI, Hiroyuki FUKAI

1996Volume 11Issue 5 Pages 338-342
Published: August 20, 1996
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep1995.11.338

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Flip Chip Bonding Technology

Yutaka TSUKADA

1996Volume 11Issue 5 Pages 343-346
Published: August 20, 1996
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep1995.11.343

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Assembly Technology by Conductive Adhesive Resin

Kenzo HATADA

1996Volume 11Issue 5 Pages 347-350
Published: August 20, 1996
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep1995.11.347

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Assembly Technology by Light-Setting Insulating Resin

Kenzo HATADA

1996Volume 11Issue 5 Pages 351-355
Published: August 20, 1996
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep1995.11.351

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Thin Film Laminated Multilayer Substrate

Akio TAKAHASHI, Takeyuki ITABASHI

1996Volume 11Issue 5 Pages 356-360
Published: August 20, 1996
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep1995.11.356

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The Substrate with Predrilled and Plated Via Arrays and CAD Layout

Tamihei TAKAHASHI

1996Volume 11Issue 5 Pages 361-364
Published: August 20, 1996
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep1995.11.361

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Standardization of Data Format

Shunichi ASAO

1996Volume 11Issue 5 Pages 365-369
Published: August 20, 1996
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep1995.11.365

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Bare Chip Mounting System—Flip Chip Bonder

Mitsuru OZONO

1996Volume 11Issue 5 Pages 370-374
Published: August 20, 1996
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep1995.11.370

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Two Scan Methods Testing MCM

Kazunori OHTSUKA

1996Volume 11Issue 5 Pages 375-378
Published: August 20, 1996
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep1995.11.375

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