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Volume 21 (2001)
- Issue 83 Pages 203-
- Issue 82 Pages 141-
- Issue 81 Pages 81-
- Issue 80 Pages 2-
- Issue 2Supplement Pag･･･
- Issue 1Supplement Pag･･･
Volume 21, Issue 2Supplement
Displaying 51-53 of 53 articles from this issue
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Toshitsugu HARA, Yoshikazu MATSUMOTO, Yusuke KUDO, Takanori SHIMAOKA2001 Volume 21 Issue 2Supplement Pages 153-154
Published: September 15, 2001
Released on J-STAGE: September 03, 2009
JOURNAL FREE ACCESSRadial temperature distribution in a heated food (baked sweet potato, roasted fish and a slice of bread) was visualized by an infrared camera. The temperature distribution in those heated foods were different from predicted value when the food was heated up above 65-70 degree C. The temperature distribution at the outer part of the food was steeper than the predicted value. Temperature distribution at the inner part of the food was flattened than the predicted value.View full abstractDownload PDF (399K) -
Masaru Kawarazaki, Noriyo Sakurada, Yoshio Ishii, Kazuhiro Watanabe, Y ...2001 Volume 21 Issue 2Supplement Pages 155-158
Published: September 15, 2001
Released on J-STAGE: September 03, 2009
JOURNAL FREE ACCESSThe dye colored by heat is observed in our laboratory and it is inquiring about the laser coloring method using CO2 laser as a thermal source. Coloring dye can color various plastics by diluting with water and heating. CO2 laser is suitable as a heat source, since the absorptivity to water is high. This dye is applied to a coloring object, it heats by irradiating laser light, and coloring becomes possible. The difference, However, had arisen between the laser irradiation range and the coloring range by old research. In order to solve this cause, an infrared thermography camera was used and thermal analysis of a laser irradiation part was performed. It will be considered by this analysis that the improvement of the laser coloring method in accuracy is possible.View full abstractDownload PDF (1185K) -
Noriyo Sakurada, Kotaro Takagi, Yoshio Ishii, Kazuhiro Watanabe, Yuzur ...2001 Volume 21 Issue 2Supplement Pages 159-160
Published: September 15, 2001
Released on J-STAGE: September 03, 2009
JOURNAL FREE ACCESSA cause of fail circuit boards is mainly dominated by a defect of soldering. By leaving this defect, parts on the circuit board are destructed by over current or voltage. A detecting defect of a circuit board is necessary to prevent a circuit board from this destruction. A massed circuit board, however, make it difficult that a lot of parts on the circuit board are detected by a visual inspection. Today, various inspecting devices have been researched and developed using a visible CCD device. More high-precision and high-detecting capability, furthermore, are required for an inspecting devices.
In this study, a new method for a detecting defect has been attractively attempted using a infrared thermography camera. A soldering side of circuit board which was cooled from a behind parts side of the board by cooling board was observed using a thermography camera. From a thermal image which has a different of temperature transition depend on sold-mass, a detection can be achieved whether a mass of sold is optimum or not.View full abstractDownload PDF (705K)