KONA Powder and Particle Journal
KONA Powder and Particle Journal is a peer-reviewed, international, interdisciplinary and Diamond open-access journal that publishes articles on powder and particle science and technology.

   KONA Powder and Particle Journal is a refereed scientific journal that publishes articles on powder and particle science and technology. This journal has been published annually since 1983 and is distributed free of charge to researchers, members of the scientific communities, universities and research libraries throughout the world, by Hosokawa Powder Technology Foundation established by Mr. Masuo Hosokawa in 1991.
  The Chinese character “粉” in the cover is pronounced “KONA” in Japanese, and means “Powder”. The calligraphy of it is after the late Mr. Eiichi Hosokawa, founder of the Hosokawa Micron Corporation.
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1,339 registered articles
(updated on April 30, 2025)
Online ISSN : 2187-5537
Print ISSN : 0288-4534
ISSN-L : 0288-4534
4.1
2023 Journal Impact Factor (JIF)
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Featured article
Volume 41 (2024) Pages 26-41
Role of Powder Properties and Flowability in Polymer Selective Laser Sintering—A Review Read more
Editor's pick

This review highlights the crucial role of powder flowability in polymer selective laser sintering (SLS), a leading additive manufacturing technology for producing highly complex and customized components. It explores key flowability characterization methods suitable for SLS and examines how powder properties influence laser­–material interactions and final part quality. Additionally, the paper discusses various strategies from the literature to enhance powder spreading, addressing a critical challenge in expanding the range of polymer materials suitable for SLS. This review serves as a valuable resource for advancing material development and optimizing the SLS printing performance.

Volume 41 (2024) Pages 183-196
Characteristics of Ultrafine Bubbles (Bulk Nanobubbles) and Their Application to Particle-Related Technology Read more
Editor's pick

In recent years, ultrafine bubbles have been actively used in the cleaning field. Ultrafine bubbles have numerous advantages, including their chemical-free nature, hydrophobic, pH-dependent surface charge, and extraordinarily long lifetime. By selecting the ultrasonic frequency to be irradiated, the generation and removal of ultrafine bubbles can be controlled. They can produce hollow nanoparticles and enhance ionic adsorption on activated carbon. This review discusses the fundamental and sonochemical characteristics of ultrafine bubbles and their applications in particle-related technologies, encompassing fine particle synthesis, adsorption, desorption, extraction, cleaning, and fouling prevention.

Volume 41 (2024) Pages 108-122
A Review of Analytical Methods for Calculating Static Pressures in Bulk Solids Storage Structures Read more
Editor's pick

This comprehensive review examines the evolution and applications of the Janssen equation, which is the dominant expression for calculating pressures in bulk storage structures. This paper discusses the history of the model, analyzes the limitations of Janssen’s original formulation and explores various modifications and alternative models developed to better represent shear stress distributions. By examining key parameters like stress ratios (k), friction coefficients (μ, ϕ), and bulk density (ρ), along with modern approaches such as continuum elastic and microscopic theories, this work provides valuable insights for engineers and researchers working with bulk solids storage systems and granular materials.

Volume 42 (2025) Pages 79-99
Engineering SiO2 Nanoparticles: A Perspective on Chemical Mechanical Planarization Slurry for Advanced Semiconductor Processing Read more
Editor's pick

SiO₂ nanoparticles are the most widely used abrasives in chemical mechanical planarization (CMP) slurries, where their structure and surface properties govern dispersion stability, abrasive-abrasive interactions, and abrasive-film interactions. Controlling these factors is essential for achieving desired material removal rates, defect suppression, and polishing uniformity in CMP. This review explores SiO₂ nanoparticle engineering, focusing on synthesis approaches and surface modifications such as functionalization, coating, and doping to regulate dispersion stability, interfacial interactions, and chemical reactivity. It provides insights into how these engineered nanoparticles influence the CMP performance and their role in semiconductor manufacturing.

Volume 41 (2024) Pages 58-77
About Modeling and Optimization of Solid Bowl Centrifuges Read more
Editor's pick

This review provides an overview of the many applications of solid bowl centrifuges, the different types of machines, and the modeling strategies. Common to all centrifuges is that the material behavior has a significant influence on the process behavior; therefore, the interaction between material and process is of critical importance. Different modeling strategies can be used to better understand and optimize separation processes. Furthermore, the integration of process analytics into the operation of solid bowl centrifuges allows on-line optimization of the process behavior.

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