There is an epoxy resin having an aromatic diketone structure as one measure for improving heat resistance of epoxy cured product. After obtaining bisphenol compound (BHBB) by Fries rearrangement reaction of diphenyl isophthalate, epoxy resin having aromatic diketone structure (BGBB) was synthesized by epoxidation reaction. As a result of evaluating the physical properties of the cured product obtained from BGBB and phenol novolac, the glass transition temperature was 159℃, which was 32℃ higher than that of bisphenol A type epoxy resin, and 13℃ higher than that of phenol aralkyl type epoxy resin. In addition, the char yield at 700℃ is 35.7 wt%, which is significantly higher than 25.9 wt% of GPAR, and the 10 wt% weight loss temperature is 410℃, which indicates a high thermal decomposition stability of the BGBB cured product.
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