To enhance the thermal conductivity of epoxy resin composites, we focused on trans-resveratrol (tRES), a natural polyphenol with a rigid conjugated structure, as a phenolic curing agent, and developed bio-based high thermal conductivity and insulating composites. However, the high melting point of tRES posed challenges for mixing and molding during composite preparation. To address this, we utilized the photoisomerization reaction of the stilbene structure in tRES to synthesize its cis isomer (cRES). The melting behavior of cRES showed a significant reduction in melting point to approximately 100℃, and cRES also demonstrated superior compatibility with epoxy resins.Using cRES as a hardener under the presence of a triphenylphosphine catalyst, we cured typical biphenyl epoxy resin at 175℃. This resulted in a 25% higher thermal diffusivity compared to conventional novolac hardener (OCN), confirming the potential of cRES for improving thermal conductivity. Furthermore, combining this curing system with 90 wt% alumina filler produced a composite with a 32% biomass ratio relative to the total resin content. This system exhibited excellent molding flowability and achieved a 12% higher thermal conductivity than the OCN-based system. These results indicate that this environmentally friendly, high thermal conductivity material has potential applications as an encapsulant for next-generation power semiconductor packages.
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