これまで我々は、光ファイバの先端を45度に加工した光ピンを光導波路に結合させる事をベースとした、光インターコネクションの展開を検討してきた。さらに今後、光インターコネクションが進展すると、電気配線の光配線への単なる置き換えではなく光固有の機能を生かすことを考えなければならない。ここでは光配線の伝送路として、光導波路の代わりに光ファイバを用いた光ファイバ平面回路を提案する。次に実際に光ファイバを用いて初期的な光ファイバ回路の試作を行ったので、その結果を報告する

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This paper describes the strength evaluation of surface mount solder joints. Recently Surface Mount Technology (SMT) has advanced with high density assembly of circuit. However, the reliability of surface mount solder joints may be lower than that of through-mount solder joints. So, the strength evaluation of surface mount solder joints is required. In this study, tensile tests for various specimens of butt-leaded surface mount solder joints have been conducted at first. Secondly, two-dimensional elastic-plastic analyses of the joints have been carried out by finite element method. From these results, the relation between the geometry and the strength of butt-leaded surface mount solder joints has been obtained.

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ボードレベル光インタコネクションの実現のためには、90度光路変換がキーテクノロジーとなる。我々は90度光路変換に先端を45°に加工した光ファイバ(光ピン)を用いる方法を提案している。本研究では光ピンを用いたマルチ光ピンコネクタを試作し、光導波路や擬似光導波路を用いた光結合特性の評価を行った。

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我々は従来の光ピンを改良し、先端面を様々な形状に加工した新しい光ピンを研究している。この光ピンは、光路変換に加えて、マルチモード1対Nスプリッタの機能を持つため、配線の自由度を高め、並列処理の実現を可能とする。今回は1対2分岐V字型光ピンに着目し、光線追跡法による解析を行った。また、実際にPOF（Plastic Optical Fiber）を用いてV字型光ピンを試作し、分岐光の評価を行った。

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家電製品などの意匠曲線形状のデザインにおいて, 手描きスケッチを複数の円弧で近似し, 3次元モデルの特徴曲線として, 3次元モデルを作成する方法が用いられているが, デザイナーが直接形状を入力したり, 形状を修正することは難しい.そこで, デザイナがスケッチを描く場合, 曲率半径の大きさにより, ペン速度を変えていることに注目し, 本研究では, 速度をパラメータとする特徴曲線の生成方法を提案し, その有効性を検討する.

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The advantages and limitations of extremely thin thermosetting adhesive film (TTAF) are discussed. The properties of TTAF with a thickness range between 5 and 35 micrometers were investigated. The strength of adhesion was found to strongly depend on the film thickness below 10 micrometers. These behaviors can be explained by the Kaelble's equation and Goland-Reissner analysis. Effect of adhesive thickness on the solder heat resistance was also measured. A model based on fracture mechanical analyses for blister test was introduced to predict the adhesive de-bonding during solder reflow. The model predicted little thickness dependence of the solder heat resistance. On the other hand, higher solder heat resistance was observed for thinner adhesive samples. Since the ultimate adhesive thickness depends on the bonding process, the flow study for TTAF is important. Novel analytical method of the adhesive flow is developed.

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　中国広東省の深圳－東莞に至るエリアは，現在「世界の工場」と言われている．特に，OA機器に関する世界最大の生産地になっている．それを促した条件としては「広東型委託加工」「転廠」「無限大の労働力供給」「香港のビジネス環境の良さ」が指摘される．香港企業，台湾企業の進出が多い．日本勢としては，「深圳テクノセンター」と言われる組織が，興味深い活動をしている．

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At the beginning of the 1960s, electronics component makers experienced difficulties as a result of the increased variety of products, since this hampered the progress of mass-production and cost reductions. The Electronic Industries Association of Japan (EIAJ) tried to solve this problem by making group standards (Component Engineering Standards: CES) which were suited to the markets of the day. In the process of making the draft standards, not only components makers but also television and radio set-makers joined the working groups and delivered their opinions. The working groups avoided setting strict standards so that members would not hesitate to use them. By the end of the 1960s, more than 80 CES had been established. Many set-makers used the CES standards to reduce the variety of components they purchased and this enabled the components makers to increase the level of mass-production. JIS standards were only applied to the establishment of technical terms, to definitions and to methods of testing. A negative point, however, was that as the tolerance of CES was assumed to be at a level similar to JIS, CES standards could not serve as a target for components makers who had already attained manufacturing techniques superior to JIS. These firms therefore gave priority to in-house specifications rather than to CES when producing parts for which new techniques were required.

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